US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Method of forming semiconductor device having isolation structure" (Taiwanese Inventor)

Posted On: 2026-08-12

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,709, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan). "Method of forming semiconductor de... Read More

US Patent Issued to FUJI ELECTRIC on Aug. 11 for "Semiconductor device" (Japanese Inventor)

Posted On: 2026-08-12

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,710, issued on Aug. 11, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Akihiro Jonishi (M... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor device with CMOS inverter" (South Korean Inventors)

Posted On: 2026-08-12

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,711, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device with CMOS inverter" was... Read More

US Patent Issued to Intel on Aug. 11 for "Amorphized subfins using backside implantation" (Oregon Inventors)

Posted On: 2026-08-12

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,712, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.). "Amorphized subfins using backside implantation" was invented by... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Stacked device structures and methods for forming the same" (Taiwanese Inventors)

Posted On: 2026-08-12

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,713, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Stacked device structures and metho... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "FinFET device having flat-top epitaxial features and method of making the same" (Taiwanese Inventors)

Posted On: 2026-08-12

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,714, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "FinFET device having flat-top epita... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor structure and method for manufacturing the same" (Taiwanese Inventor)

Posted On: 2026-08-12

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,715, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure and method ... Read More

US Patent Issued to Skyworks Solutions on Aug. 11 for "Silicon-on-insulator substrate processing for transistor enhancement" (Massachusetts Inventors)

Posted On: 2026-08-12

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,716, issued on Aug. 11, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Silicon-on-insulator substrate processing for transistor... Read More

US Patent Issued to Semiconductor Energy Laboratory on Aug. 11 for "Display apparatus and electronic device" (Japanese Inventors)

Posted On: 2026-08-12

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,717, issued on Aug. 11, was assigned to Semiconductor Energy Laboratory Co. Ltd. (Kanagawa-ken, Japan). "Display apparatus and electronic d... Read More

US Patent Issued to WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY on Aug. 11 for "Array substrate, method of manufacturing thereof, and display panel" (Chinese Inventors)

Posted On: 2026-08-12

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,718, issued on Aug. 11, was assigned to WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY Co. LTD. (Wuhan, China). "Array s... Read More

Exclusive

Category

Source

Publication

Byline

Location

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Method of forming semiconductor device having isolation structure" (Taiwanese Inventor)

US Patent Issued to FUJI ELECTRIC on Aug. 11 for "Semiconductor device" (Japanese Inventor)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor device with CMOS inverter" (South Korean Inventors)

US Patent Issued to Intel on Aug. 11 for "Amorphized subfins using backside implantation" (Oregon Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Stacked device structures and methods for forming the same" (Taiwanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "FinFET device having flat-top epitaxial features and method of making the same" (Taiwanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor structure and method for manufacturing the same" (Taiwanese Inventor)

US Patent Issued to Skyworks Solutions on Aug. 11 for "Silicon-on-insulator substrate processing for transistor enhancement" (Massachusetts Inventors)

US Patent Issued to Semiconductor Energy Laboratory on Aug. 11 for "Display apparatus and electronic device" (Japanese Inventors)

US Patent Issued to WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY on Aug. 11 for "Array substrate, method of manufacturing thereof, and display panel" (Chinese Inventors)